| 发明名称 |
Stress and force management techniques for a semiconductor die |
| 摘要 |
Stress and force management techniques for a semiconductor die to help compensate for stress within the semiconductor die and to help compensate for forces applied to the semiconductor die to minimize damage thereto.
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| 申请公布号 |
US2007018336(A1) |
申请公布日期 |
2007.01.25 |
| 申请号 |
US20060516097 |
申请日期 |
2006.09.05 |
| 申请人 |
FARNWORTH WARREN M;HIATT WILLIAM M;MURPHY TIM E;CALDWELL JOHN L;SLAUGHTER MICHAEL;HEMBREE DAVID R;WANKE JAMIE J |
发明人 |
FARNWORTH WARREN M.;HIATT WILLIAM M.;MURPHY TIM E.;CALDWELL JOHN L.;SLAUGHTER MICHAEL;HEMBREE DAVID R.;WANKE JAMIE J. |
| 分类号 |
H01L23/48;H01L21/56;H01L23/485 |
主分类号 |
H01L23/48 |
| 代理机构 |
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