发明名称 Encapsulation of chemically amplified resist template for low pH electroplating
摘要 Systems and methods for encapsulation of chemically amplified resist template for low pH electroplating are disclosed. In a first method embodiment, a resist template structure is formed on a wafer. Substantially all surfaces of the resist template structure are encapsulated to form an encapsulated structure. Magnetic materials are plated onto the encapsulated structure.
申请公布号 US2007020386(A1) 申请公布日期 2007.01.25
申请号 US20050186166 申请日期 2005.07.20
申请人 BEDELL DANIEL W;LAM JOHN W;LAST MATTHEW W;LEE KIM Y;LO JYH-SHUEY;MCKEAN DENNIS R;WANG CHUN-MING ALBERT;ZHENG YI 发明人 BEDELL DANIEL W.;LAM JOHN W.;LAST MATTHEW W.;LEE KIM Y.;LO JYH-SHUEY;MCKEAN DENNIS R.;WANG CHUN-MING (ALBERT);ZHENG YI
分类号 B05D5/12;B05C11/02;B05D1/36;B05D5/00 主分类号 B05D5/12
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