发明名称 |
Encapsulation of chemically amplified resist template for low pH electroplating |
摘要 |
Systems and methods for encapsulation of chemically amplified resist template for low pH electroplating are disclosed. In a first method embodiment, a resist template structure is formed on a wafer. Substantially all surfaces of the resist template structure are encapsulated to form an encapsulated structure. Magnetic materials are plated onto the encapsulated structure.
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申请公布号 |
US2007020386(A1) |
申请公布日期 |
2007.01.25 |
申请号 |
US20050186166 |
申请日期 |
2005.07.20 |
申请人 |
BEDELL DANIEL W;LAM JOHN W;LAST MATTHEW W;LEE KIM Y;LO JYH-SHUEY;MCKEAN DENNIS R;WANG CHUN-MING ALBERT;ZHENG YI |
发明人 |
BEDELL DANIEL W.;LAM JOHN W.;LAST MATTHEW W.;LEE KIM Y.;LO JYH-SHUEY;MCKEAN DENNIS R.;WANG CHUN-MING (ALBERT);ZHENG YI |
分类号 |
B05D5/12;B05C11/02;B05D1/36;B05D5/00 |
主分类号 |
B05D5/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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