| 摘要 |
<p>An imaging device includes: a semiconductor imaging element having a plurality of photo diodes and color filters; and an imaging optical system for introducing light from an object to the semiconductor imaging element. An opening of each of the photodiodes of the semiconductor imaging element has a diameter (40, 41) decided according tot he wavelength of the light transmitting through the color filter arranged at the incident surface side of the photodiode. Thus, in a camera module using the semiconductor imaging element, the pixel size is reduced. It becomes possible to prevent image degradation of the imaging device within a range affected by undulations and reduce the device size and thickness.</p> |
