发明名称 METHOD OF MANUFACTURING ELECTRONIC SUBSTRATE, ELECTRONIC SUBSTRATE AND ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor chip 1 which can easily manufacture a toroidal inductor 40. SOLUTION: The method has a process of forming a first wiring 12 on the semiconductor chip 1; a process of forming a stress relieving layer 30 so as to cover the first wiring 12; a process of drilling the layer 30 to provide through holes 33, 34, thereby exposing the end of the first wiring 12; and a process of forming a second wiring 22 from the end of the first wiring 12 through the through holes 33, 34 to the surface of the layer 30, thereby forming the toroidal conductor 40 having the first and second wirings 12 and 22 as wirings and the layer 30 as a core 42. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007019071(A) 申请公布日期 2007.01.25
申请号 JP20050196094 申请日期 2005.07.05
申请人 SEIKO EPSON CORP 发明人 HASHIMOTO NOBUAKI
分类号 H01L23/12;H01L21/3205;H01L21/822;H01L23/52;H01L27/04 主分类号 H01L23/12
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