| 摘要 |
PROBLEM TO BE SOLVED: To provide a board for manufacturing a semiconductor device which can materialize a simple and reliable manufacturing of a semiconductor device. SOLUTION: The board for manufacturing the semiconductor device 50 comprises a wafer 1 and an adhesive layer 2 formed on the wafer 1. The wafer 1 is formed of a plurality of semiconductor elements 5, a bump 3 arranged in the circumferential part of the semiconductor element 5, and an alignment mark arranged similarly in the circumferential part of the semiconductor element 5. The adhesive layer 2 is formed thicker at a center where the bump 3 is not arranged than the circumferential part where the bump 3 of the respective semiconductor elements 5 is arranged. COPYRIGHT: (C)2007,JPO&INPIT
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