| 摘要 |
PROBLEM TO BE SOLVED: To attain improvement of reliability of mounting, applicability to a narrow pitch, and realization of disuse of an underfill etc. SOLUTION: The semiconductor device includes an insulating substrate 1 having wiring 11, and a semiconductor element 2 which is mounted on the insulating substrate 1 and has an electrode 21 on the surface of side of the insulating substrate 1. The insulating substrate 1 has a via-hole B of a truncated cone leading to the wiring 11. The diameter d1 of the via-hole B of side of the semiconductor element 2 is larger than the diameter d2 of side of the wiring 11 and is larger than the diameter d3 of the electrode 21. The electrode 21 is connected to the wiring 11 through a conductive material 3 filled in the via-hole B. COPYRIGHT: (C)2007,JPO&INPIT
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