| 摘要 |
<p>[PROBLEMS] To provide a method for improving adhesiveness between a glass substrate and an electroless copper plating film without sacrificing high frequency conductive property. [MEANS FOR SOLVING PROBLEMS] The glass substrate (1) having a smooth surface is dipped in an electroless copper plating bath, and the electroless copper plating film (4) is formed on one plane of the glass substrate (1). Then, a minus electrode (11) is pressed to the glass substrate (1), and a plus electrode (12) is pressed to the electroless copper plating film (4) to apply a voltage between electrodes (11, 12), and the electroless plating film (4) is heated.</p> |
