发明名称 ANISOTROPIC CONDUCTION FILM FOR GLASS BASE PLATE CONNECTION
摘要 PROBLEM TO BE SOLVED: To provide an anisotropic conduction film wherein adhesion between electrode terminals facing each other is realized with good electric connection property while maintaining insulating property between adjacent electrode terminals, when connecting the electrode terminal formed on a glass base plate like liquid crystal panel, and good visibility is secured when aligning the position of the electrode terminals. SOLUTION: The anisotropic conduction film is composed of at least organic binder, alloy particle containing copper component, and inorganic filler having the average particle size of 10 to 1,000 nm. The content of the alloy particle and the inorganic filler are 0.1 to 10 volume%, and 0.001 to 0.5 volume% respectively, and the film thickness of the anisotropic conduction film is 10 to 60μm. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007018760(A) 申请公布日期 2007.01.25
申请号 JP20050196270 申请日期 2005.07.05
申请人 ASAHI KASEI ELECTRONICS CO LTD 发明人 TAKEMASA HIROSHI;YOKOYAMA AKINORI
分类号 H01R11/01;G02F1/1345;H01B5/16 主分类号 H01R11/01
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