MINIATURE FLUID-COOLED HEAT SINK WITH INTEGRAL HEATER

摘要

A temperature control device (100) that includes a miniature liquid-cooled heat sink (103) with integral heater and sensing elements (132,134) is used as part of a system to provide a controlled temperature surface to an electronic device, such as a semiconductor device, during the testing phase. The temperature control device (100) includes an interface surface configured to provide a thermal path from the device to a device under test. One such device has a liquid-cooled heat sink (103) comprising a first heat transfer portion (122) in a first plane and a second heat transfer portion (120) in a second plane. The first and second heat transfer portions establish a three-dimensional cross-flow of coolant within the heat sink structure. An alternate embodiment includes parallel fluid conduits, each having a three-dimensional microchannel structure that directs coolant flow in three dimensions within the fluid conduits. Coolant flows in opposite directions through adjacent fluid conduits.