| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive heat-curable resin composition having a long shelf life, having excellent storage stability at ordinary temperature, having resistance to the heat of soldering after curing, and capable of maintaining high adhesive force. <P>SOLUTION: The photosensitive heat-curable resin composition contains a photosensitive prepolymer, a photosensitive monomer, a thermosetting resin, a curing agent and a polymerization initiator, wherein the photosensitive heat-curable resin composition contains (A) a carboxylic acid modified bisphenol type epoxy (meth)acrylate as the photosensitive prepolymer. <P>COPYRIGHT: (C)2007,JPO&INPIT |
