| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate assembly production method capable of manufacturing a substrate assembly densified by mounting an electronic component in a space between substrates. <P>SOLUTION: The substrate assembly production method comprises the steps of applying solder paste 31 onto the upper face of a first substrate 20, arranging an electronic component 40 in the upper face of the first substrate where solder paste is applied, arranging a second substrate 50 in the upper side of the electronic component and the upper face of the first substrate, and curing solder paste. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
