Substrate for integrated circuit packs has chip fitted on one side, while solder balls are located on other side for connection to terminal contacts of chip

摘要

Substrate (2) for IC packs includes on one side chip and on other side solder balls for electric connection to terminal contacts of chip. There are severasl fibre structures contained in wiring including foils (prepregs).Prepregs (3-1,3-2,3-3) are bound in resin and have different thermomechanical properties. They form sandwich of laminated foils as substrate. Preferably, main orientation of fibre structure in each prepreg is different.