Wafer treatment method fixes wafer with specified sections onto clamping table of polishing machine, with wafer upside down, for section of wafer rear side polishing

摘要

Wafer treatment method facilitates dividing into components by grooves, forming component region surrounded by edge region. It contains rear side polishing of wafer clamp on clamping table of polishing machine, with wafer positioned upside down.Polishing produces rear side depression, corresponding to front side component region, surrounded by rear side, annular strengthening edge. Then protective foil is applied on depressed region, followed by separating wafer components on clamping table of separating machine.