发明名称 FIRING TOOL FOR ELECTRONIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a firing tool for electronic components to which an electronic component is not adhered after being fired and which can prevent the separation of the coating layer therefrom and the formation of appearance defects on the electronic components. <P>SOLUTION: The firing tool for electronic components has a coating layer on the surface of a substrate made of a ceramic. The coating layer comprises an intermediate layer formed on the surface of the substrate and containing at least one layer comprising a material which absorbs components coming from the component to be fired and passing the surface layer, and adversely affecting the substrate and the surface layer formed on the surface of the intermediate layer and made of a material less reactive with the component to be fired. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007015882(A) 申请公布日期 2007.01.25
申请号 JP20050197682 申请日期 2005.07.06
申请人 NGK INSULATORS LTD;NGK ADREC CO LTD 发明人 NIHONMATSU HIROAKI;HOTTA HIROYUKI;NAKANISHI YASUHISA
分类号 C04B41/87;C04B35/48;C04B35/64;C04B41/89;F27D3/12 主分类号 C04B41/87
代理机构 代理人
主权项
地址
您可能感兴趣的专利