发明名称 MOUNTING METHOD OF ELECTRIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a mounting method of electric components whereby electrodes can be joined at a low temperature and low weight in a short time, and a joined part with high reliability can be obtained . <P>SOLUTION: In the method of mounting an electric component 20 on a circuit board 10, a metal-made element electrode 21 formed on the electric component 20 is joined with a metal-made circuit electrode 11 formed on a circuit board 10 so as to mount the electric component 20 on the circuit board 10. Low melting point metallic layers 31, 32 are formed in advance on the circuit electrode 11 and the element electrode 21. Thereafter, metallic powder 33 is applied to each of the low melting point metallic layers 31, 32 made of the same type of material as that of the element electrode 21 or the circuit electrode 11, or made of a material into which the low melting point metallic layers 31, 32 can be diffused. The element electrode 21 and the circuit electrode 11 are located opposite to each other, heated and pressed at a temperature at which the low melting point metallic layers 31, 32 are melted to join the low melting point metallic layers 31, 32 with the element electrode 21, the circuit electrode 11 and the metallic powder 33 through solid-liquid diffusion. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007019360(A) 申请公布日期 2007.01.25
申请号 JP20050201126 申请日期 2005.07.11
申请人 FUJI ELECTRIC HOLDINGS CO LTD 发明人 TANIGUCHI KATSUMI
分类号 H01L21/60;B23K20/00;B23K101/42;H05K3/34 主分类号 H01L21/60
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