发明名称 |
LIGHT EMITTING DIODE MODULE, BACKLIGHT ASSEMBLY EQUIPPED WITH IT, AND DISPLAY DEVICE EQUIPPED WITH IT |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting diode module in which heat resistance and endurance are improved and, at the same time, heat dissipation efficiency is also improved, and to provide a backlight assembly equipped with it and a display device equipped with it. <P>SOLUTION: The light emitting diode module has a printed-circuit board (PCB) which has a plurality of bonding holes; a plurality of light emitting diodes (LED) which have a light emitter which generates light, and a lead in which one side is electrically connected to the light emitter and the other side is located in the bonding hole; and a cement which is filled with the bonding hole in which the lead is located. <P>COPYRIGHT: (C)2007,JPO&INPIT |
申请公布号 |
JP2007019519(A) |
申请公布日期 |
2007.01.25 |
申请号 |
JP20060189453 |
申请日期 |
2006.07.10 |
申请人 |
SAMSUNG ELECTRONICS CO LTD |
发明人 |
KIM GI-CHERL;LEE SANG-YU;YANG BYUNG-CHOON;SO SHUNKO;CHO DON-CHAN |
分类号 |
H01L33/62;F21S2/00;F21V19/00;F21V29/00;F21Y101/02;G02F1/13357;H01L33/64 |
主分类号 |
H01L33/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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