| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method using a resin sealing progress for forming a plurality of semiconductor packages obtained by resin-sealing a semiconductor element mounted on a wiring board having exposed copper wiring on a side face in a batch and a semiconductor package manufactured by this method. <P>SOLUTION: A wiring board 2 of an aggregate substrate is half-cut more deeply than the bottom of a wiring pattern 4 along the region of the wiring board 2, a semiconductor chip 1 is mounted in every formation region of a wiring board 2, and the semiconductor chip 1 and the wiring pattern 4 are bonded 8. The semiconductor chip 1 on the aggregate substrate is resin-sealed 9 in a batch, and a solder ball 10 is mounted on the aggregate substrate. Then, the aggregate substrate is diced so that the semiconductor package can be divided into pieces. The width of a blade for half-cutting is made larger than the width of a blade for full-cutting, the blade mark of half-cutting is left in the periphery of the wiring board 2 as a notched part 3a, the part is filled with a resin sealing body 9a, and a wiring pattern 4 exposed on the side face is coated so as to be protected. <P>COPYRIGHT: (C)2007,JPO&INPIT |
