| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a memory card, having a structure which retains favorable coplanarity with its warpage due to thermal stress suppressed and has enhanced mechanical strength, and in which an IC package bonded to a base card will hardly strip off. <P>SOLUTION: The memory card is provided with a substrate with a data storage IC mounted thereon; insulation sealing resin which covers the data storage IC on the substrate to insulate and protect it from the outside, and has a projecting part formed integrally therewith, which projects from an end of the substrate at least on a side thereof; and the base card which has a recess-like pocket part, having an engaging part to engage with the projecting part, wherein the IC package, composed of the substrate and the insulation sealing resin with an electrode terminal provided on the bottom face of the substrate exposed and the projecting part and the engaging part engaged, is housed in, bonded to and fixed to the recess-like pocket part. <P>COPYRIGHT: (C)2007,JPO&INPIT |
