发明名称 COMPONENT PACKAGING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To cut a housing tape on a condition that a component is taken out. <P>SOLUTION: A component packaging apparatus 1 comprises: a cut mechanism 20 for cutting a housing tape 15 after a component is taken out; and a control unit 17 for controlling a timing to cut the housing tape 15 by the cut mechanism 20. The control unit 17 operates the cut mechanism 20 on the basis of detecting that a component 12 is taken out of the housing tape 15. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007019373(A) 申请公布日期 2007.01.25
申请号 JP20050201308 申请日期 2005.07.11
申请人 YAMAGATA CASIO CO LTD 发明人 WATANABE MASATO
分类号 H05K13/02;H05K13/08 主分类号 H05K13/02
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