| 摘要 |
A microphone package has a first die (10), a microphone (15) formed on the first die, one or more passive components (20) formed on the first die, and an integrated circuit (25) on a second die (30), mounted on the first die and electrically coupled to the microphone or passive components. Compared to integrating the microphone on the same die as an integrated circuit, the first die can use fewer layers, and fewer processing steps. An integrated capacitive microphone has a diaphragm (70, 230) and a backplate (120, 190) for the microphone made of Al or AlCu on a substrate (40). These materials are more conductive and therefore the associated circuitry can be more sensitive or use less power. Forming the diaphragm and backplate by evaporation or sputtering of Al or AlCu on a substrate is more cost effective. |
