A leadframe for a semiconductor package is disclosed including electrical leads which extend from one side of the leadframe to an opposite side of the leadframe, where electrical connection may be made with the semiconductor die at the second side of the leadframe. The semiconductor die may be supported on the leads extending across the leadframe. The package may further include a spacer layer affixed to the electrical leads to fortify the semiconductor package and to prevent exposure of the electrical leads during the molding of the package.
申请公布号
WO2007011511(A2)
申请公布日期
2007.01.25
申请号
WO2006US25302
申请日期
2006.06.28
申请人
SANDISK CORPORATION;LEE, MING, HSUN;LIAO, CHIH-CHIN;YU, CHEEMEN;TAKIAR, HEM
发明人
LEE, MING, HSUN;LIAO, CHIH-CHIN;YU, CHEEMEN;TAKIAR, HEM