发明名称 SEMICONDUCTOR MANUFACTURING APPARATUS
摘要 An apparatus for fabricating a semiconductor is provided to prevent polymer from being deposited on a door by making the door have a temperature not lower than that of the inner wall of a chamber. An inlet/outlet through which a substrate is loaded/unloaded is formed in a chamber in which a space for performing a semiconductor process is performed. The inlet/outlet of the chamber is opened/closed by a door(114). At least one heater member(130) is included in the door to heat the door. A dry etch process or a chemical vapor deposition process is performed on the wafer in the chamber. The chamber further includes a temperature detecting part and a control part. The temperature detecting part measures the temperature of the inner wall of the chamber. The control part receives an electrical signal transferred from the temperature detecting part to control the heater member.
申请公布号 KR20070012070(A) 申请公布日期 2007.01.25
申请号 KR20050066893 申请日期 2005.07.22
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KWON, TAE KYUNG
分类号 H01L21/3065;H01L21/02 主分类号 H01L21/3065
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