| 摘要 |
A wafer loading apparatus is provided to minimize a centering process of a wafer by arranging a wafer hole guide, which slides on an outer periphery of the wafer, such that centers of the wafer and an orient plate are aligned with each other. A wafer loading apparatus includes a shaft(110), a plate(112), a pad(114), and a wafer hole guide(116). The shaft is reciprocally and vertically moved by rotational force. The plate horizontally supports a wafer at an upper end of the shaft. The pad is formed on an upper surface of the plate. The wafer is mounted on the pad. The wafer hole guide slides an outer periphery of the wafer, which is supported on the plate, when the shaft is lowered, such that a center of the wafer is aligned with a center of the plate.
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