| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce a harmful effect by heat to the inside of a microphone by reducing the amount of solder to be used. <P>SOLUTION: This mounting substrate has a central pattern 24 formed in accordance with a central terminal 20 of the microphone, a plurality of outer patterns 25 formed in accordance with a peripheral terminal 21 of the microphone and arranged around the central pattern 24, a resist film 26 adhered surrounding respective parts 27 with no resist film formed on the central pattern 24 and the outer patterns 25, and solder members 28 placed on the parts 27 with no resist film formed surrounded with the resist film 26. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
