| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board that can be miniaturized, and to provide electronic equipment having the wiring board. <P>SOLUTION: Copper foil inside a core material 11 is etched to form first wiring 15', and a fiducial mark M is formed simultaneously. The mark M is utilized to position a metal mask when a conductive paste, which connects an electronic component 20 to the first wiring 15' electrically, is printed, is utilized to position the electronic component 20, and is utilized to position a via hole 24. When the electronic component 20 is positioned, the mark M is detected from the inside of the core material 11. When the via hole 24 is punched, the mark M is detected from the outside of the core material 11 via a substrate 13. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
