发明名称 SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD
摘要 PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus and a substrate treatment method capable of reducing space required for a driving mechanism or the like of a cup driving mechanism and an aligning mechanism, and capable of reducing cost. SOLUTION: The apparatus 45A is provided with a holding mechanism 61 for holding a substrate W, cups 62, 63 surrounding the substrate W held by the holding mechanism 61, and an aligning mechanism 65 for aligning the position of the substrate W to the holding mechanism 61. Further, the apparatus is provided with a moving mechanism 66 for relatively moving up and down the cups 62, 63, and the aligning mechanism 65 from the substrate W held by the holding mechanism 61. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007019369(A) 申请公布日期 2007.01.25
申请号 JP20050201278 申请日期 2005.07.11
申请人 TOKYO ELECTRON LTD 发明人 MATSUMOTO KAZUHISA;MATSUMOTO MASAOMI
分类号 H01L21/304;H01L21/027;H01L21/68 主分类号 H01L21/304
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