| 摘要 |
A semiconductor pressure sensor can simplify conveyance equipment on a production line, improve production operation efficiency to a substantial extent, and reduce the production cost. The semiconductor pressure sensor includes a semiconductor sensor chip for detecting pressure, a processing circuit for correcting and amplifying an electric signal from the semiconductor sensor chip, a sub package having a terminal electrically connected to the semiconductor sensor chip and the processing circuit through bonding wires, and a housing integrally formed with the sub package at an outer side thereof by insert molding. The sub package is formed with a mounting surface on which the semiconductor sensor chip and the processing circuit are mounted.
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