发明名称 Positive-type photosensitive resin composition and cured film manufactured therefrom
摘要 A positive-type photosensitive resin composition comprising component (A): an alkali-soluble resin having a functional group which undergoes heat crosslinking reaction with a compound of component (B), a functional group for film curing which undergoes thermoset reaction with a compound of component (C), and a number average molecular weight of 2,000 to 30,000; component (B): a compound having two or more vinyl ether groups per molecule; component (C): a compound having two or more blocked isocyanate groups per molecule; component (D): a photoacid generator; and component (E): a solvent. A production process of the positive-type photosensitive resin composition comprising mixing the above-mentioned components and maintaining the mixture at a temperature higher than room temperature. A cured film manufactured by using the positive-type photosensitive resin composition. The composition has a high sensitivity and little film reduction of unexposed part, maintains a high transmittance even after baking at a high temperature or resist stripping treatment, and cause no reduction of film thickness. Therefore, the composition provides a cured film suited as a film material for several displays.
申请公布号 US2007020559(A1) 申请公布日期 2007.01.25
申请号 US20060491156 申请日期 2006.07.24
申请人 NISSAN CHEMICAL INDUSTRIES, LTD. 发明人 HATANAKA TADASHI
分类号 G03C1/00 主分类号 G03C1/00
代理机构 代理人
主权项
地址
您可能感兴趣的专利