发明名称 Photoresist stripper composition and methods for forming wire structures and for fabricating thin film transistor substrate using composition
摘要 A photoresist stripper composition, a method for forming wire structures thereby, and a method of fabricating a thin film transistor substrate using the composition. The photoresist stripper composition includes about 50 WT % to about 70 WT % of butyldiglycol, about 20 to about 40 WT % of an alkylpyrrolidone, about 1 WT % to about 10 WT % of an organic amine compound, about 1 to about 5 WT % of aminopropylmorpholine, and about 0.01 to about 0.5 WT % of a mercapto compound.
申请公布号 US2007020910(A1) 申请公布日期 2007.01.25
申请号 US20060493225 申请日期 2006.07.25
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK HONG-SICK;KIM SHI-YUL;CHOUNG JONG-HYUN;SHIN WON-SUK
分类号 H01L21/44 主分类号 H01L21/44
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