发明名称 |
Thermoplastic/thermoset composition material and method of attaching a wafer to a substrate |
摘要 |
A process for mounting a wafer on a substrate includes applying a pre-applied die attach on a backside of the wafer with a composition having a thermoplastic portion and a thermoset portion. The composition has a predetermined cure temperature. The process further includes heating the wafer to a temperature sufficient to remove solvents from the thermoplastic portion of the composition below the cure temperature, mounting the wafer on the substrate, and heating the wafer and the substrate to a temperature above the cure temperature to cure the thermoset portion of the pre-applied die attach composition. A composition for performing the process is further disclosed. |
申请公布号 |
US2007020810(A1) |
申请公布日期 |
2007.01.25 |
申请号 |
US20060455226 |
申请日期 |
2006.06.16 |
申请人 |
COOKSON SINGAPORE PTE LTD. |
发明人 |
EISENACH BRIAN;PREVITI MICHAEL A.;WILSON MARK;DHOBLE AVIN |
分类号 |
H01L21/00;B32B9/00;B32B33/00;H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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