| 摘要 |
A press for a semiconductor chip bonding apparatus is provided to prevent a semiconductor chip from being damaged even in surroundings of nonuniform pressure caused by a gap difference between confronting process surfaces by making each semiconductor chip have an individually automatic center-adjusting function regardless of whether upper and lower dies are thermally transformed. A plurality of through holes having a protrusion in the inside are formed on the entire surface of at least one process surface of upper and lower dies(110,120) so that each semiconductor chip is controlled to maintain individual flatness and reduce nonuniform pressurizing inclination caused by a four-directional gap difference between confronting process surfaces of the upper and the lower dies regardless of the thermal transformation of the upper and the lower dies. One end of a plurality of contact members is hung to the protrusion, and the other end of the contact members is elastically supported and protrudes to the outside of the process surface through each through hole. A lower structure in the through hole that elastically supports the contact member includes a buffer spring, a spacer, a guide member and a support ball. The spacer supports the lower part of the buffer spring. The guide member guides the contact member to elevate stable, operating together with the contact member. The support ball supports the contact member as a liner contact state to prevent the contact member from being tilted in four directions, interposed between the contact member and the guide member.
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