| 摘要 |
A semiconductor device is provided with a sealing ring 106 made of a metal which surrounds an integrated circuit part 102 and which is formed on a substrate 104 along an outer perimeter of the rectangular device. At least one corner part 108 of the sealing ring is formed to have a larger width than other parts of the sealing ring 106 , so as to increase the rigidity and the strength of the corner part of the sealing ring 106 . Thus, the strength of the corner part of the sealing ring is improved. Also, even if the corner part of the sealing ring is lost, the penetration of moisture into the integrated circuit side is inhibited. |
