| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a sheet-mounted chip whose complete operation test is made in chip units, and also to provide a method for manufacturing the sheet-mounted chip. <P>SOLUTION: A semiconductor chip 50 is mounted to a chip mount section 100 of each unit section 20' on a chip-mount wiring sheet 200 in which a plurality of unit sections 20' are formed. In this state of the sheet, a test instrument is connected to a terminal 25 for testing to perform various kinds of tests to each semiconductor chip 50. The tests include a high-temperature bias test (Burn-in), or the like that cannot be performed in a chip state. After the test, only a region of a wiring sheet section 20 excluding the terminal 25 for testing is separated, thus obtaining the sheet mount chip 60 as KGD. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
