| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit device (LSI) having an LSI chip loading substrate with which a user can easily use a high speed device and a high speed apparatus without being conscious of timing design as a wiring board. SOLUTION: The semiconductor integrated circuit device is provided with an LSI chip 1 and the wiring board 100 on which the LSI chip 1 is loaded. The wiring board 100 is provided with an LSI chip loading region 3 and an extension region 4 which is adjacent to the LSI chip loading region 3 and loads an outer device 6 or an outer apparatus. Substrate upper wiring 5 electrically connects the LSI chip 1 and the outer device 6 loaded on the extension region 4. COPYRIGHT: (C)2007,JPO&INPIT
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