发明名称 METHOD FOR INSPECTING MASK PATTERN, METHOD FOR VERIFYING EXPOSURE CONDITION, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To realize an inspection of a mask pattern with a high sensibility. <P>SOLUTION: In an inspection method of the mask pattern, comprising irradiating a sample including a substrate surface pattern formed by the transfer of the mask pattern with an electron beam, then obtaining an image of the surface of the sample by detecting secondary electrons, reflection electrons and backscattered electrons generated from the surface of the sample, and inspecting the mask pattern based on the obtained image, the sample is formed by forming the substrate surface pattern on an electroconductive or semiconductive substrate so that the substrate surface pattern is made into a state electrically connected to the substrate. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007017599(A) 申请公布日期 2007.01.25
申请号 JP20050197522 申请日期 2005.07.06
申请人 TOSHIBA CORP 发明人 NAGAHAMA ICHIROTA;YAMAZAKI YUICHIRO;ONISHI ATSUSHI
分类号 G03F1/84;G03F1/86;H01L21/027 主分类号 G03F1/84
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