| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a small semiconductor laser unit of efficient heat radiation, of which disconnection of wire is prevented, being easy for assembly. <P>SOLUTION: The semiconductor laser unit comprises a metal plate 100 of which the width at a central part 100a is wider than that of other region, a flexible substrate 130 on which a first opening is formed, a substrate 120 provided on the central part 100a, a semiconductor laser 110 provided on the substrate 120, a frame 150 which is provided with a second opening and fixes the flexible substrate 130 by bending it along both sides from the upper surface of the metal plate 100, and a optical element 160 that covers the second opening. The flexible substrate 130 is so fixed that the first opening strides the upper surface and side surface of the central part 100a. <P>COPYRIGHT: (C)2007,JPO&INPIT |
