发明名称 |
Methods and systems for planarizing workpieces, e.g., microelectronic workpieces |
摘要 |
This disclosure provides methods and apparatus for predictably changing the thickness of a microfeature workpiece. One implementation provides a planarizing method in which a first workpiece is planarized in first and second planarizing processes and a total change in thickness is determined. This thickness change is modified by a thickness offset associated with the second planarizing process and a material removal rate is calculated from this modified thickness change and the time on the first planarizer. A thickness of a second microfeature workpiece is measured and a target thickness of material to be removed is determined. A target planarizing time is then determined as a function of the target thickness reduction and the material removal rate.
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申请公布号 |
US2007021263(A1) |
申请公布日期 |
2007.01.25 |
申请号 |
US20060471974 |
申请日期 |
2006.06.21 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
MOORE CARTER;FOLKES ELON;CASTOR TERRY |
分类号 |
F16H48/06;B24B49/00 |
主分类号 |
F16H48/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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