发明名称 |
Method for the chemical treatment of copper surfaces for the removal of carbonaceous residues |
摘要 |
A method for the treatment of copper surfaces on a semiconductor wafer for the removal of carbonaceous residues, these being obtained during a chemical-mechanical polishing operation, includes a water rinsing of the wafer followed by a chemical rinsing of the wafer using a solution containing a corrosion inhibitor and an organic acid.
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申请公布号 |
US2007017902(A1) |
申请公布日期 |
2007.01.25 |
申请号 |
US20050187707 |
申请日期 |
2005.07.22 |
申请人 |
STMICROELECTRONICS S.A. |
发明人 |
PETITDIDIER SEBASTIEN;INARD ALAIN |
分类号 |
B44C1/22;C03C25/68;H01L21/461 |
主分类号 |
B44C1/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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