发明名称 CHIP BONDING APPARATUS FOR MANUFACTURING FLAT PANEL DISPLAY
摘要 A chip pressing apparatus for manufacturing a flat panel display is provided to realize equal thermal expansion degrees at all parts of a tip by minimizing temperature deviation of the tip by forming a horizontal slot, thereby improving flatness of the tip. A heater(300) is installed inside a body(100). A tip(500) is formed at a lower end of the body for directly contacting with a chip. A horizontal slot(700) is formed between the heater and the tip in the body in a right-and-left direction on the basis of a center of the body. The horizontal slot passes through the body in a front-and-rear direction.
申请公布号 KR20070011932(A) 申请公布日期 2007.01.25
申请号 KR20050066652 申请日期 2005.07.22
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 BAE, HONG TAE
分类号 G02F1/1341 主分类号 G02F1/1341
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