| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a sealing epoxy resin composition excellent in resistance to ultraviolet rays and heat resistance for a light-emitting diode (LED) with practical applications of the LED which emits short wavelengths such as a blue color at good luminous efficiency and ultraviolet rays and excellent in transparency, and a high quality optical semiconductor device obtained by sealing the outer periphery of an optical semiconductor element with the epoxy resin composition. <P>SOLUTION: The epoxy resin composition comprises (A) an epoxy resin having a light transmission in 1 mm of the optical path length of light with a wavelength of 400 nm of at least 80%, (B) a specific silane compound and/or a specific siloxane compound, (C) a specific acid anhydride, (D) an organoaluminum compound, and (E) an organosilicon compound having a hydroxy group and/or an alkoxy group and comprises, based on the total mass of the (A) to (E) components, 1-70 mass% (B) component and 0.1-50 mass% (C) component. The optical semiconductor device is obtained by sealing a light-emitting diode element or bonding it to another member with the use of this epoxy resin composition. <P>COPYRIGHT: (C)2007,JPO&INPIT |
