| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain an epoxy resin composition that does not contain a halogen and an alkali metal being ionic impurities, has excellent resistance to moist heat, does not corrode metal even at high temperature and high humidity, has no discoloration in curing and slight heat discoloration with time and is especially suitable for sealing a semiconductor. <P>SOLUTION: The epoxy resin composition for sealing a semiconductor comprises an epoxy resin (A), an acid anhydride-based curing agent (B) and a quaternary ammonium organic acid-based curing promoter (C) represented by general formula (1) (R1 is a 1-12C alkyl group; R2 is a 1-3C alkyl group; X<SP>-</SP>is an organic acid conjugate base). <P>COPYRIGHT: (C)2007,JPO&INPIT |
