| 摘要 |
PROBLEM TO BE SOLVED: To improve manufacturing efficiency and reduce manufacturing cost in a semiconductor device which is provided with semiconductor chips such as a sound pressure sensor chip or the like. SOLUTION: The semiconductor device 1 is provided with a nearly plate-like stage 3 wherein a chip penetrating hole 3c penetrating in the direction of thickness; a semiconductor chip 7 which is fixed on one surface 3a of the stage 3 to cover the chip penetrating hole 3c; a lead 5 electrically connected with the semiconductor chip 7; a chip covering body 13 which is provided on the surface 3a of the stage 3 to cover the semiconductor chip 7; and a resin mold 17 which integrally fixes the stage 3, the lead 5, and the chip covering body 13 so that a first space 33 may be formed between the semiconductor chip 7 and itself by means of the chip covering body 13 while the lead 5 is being exposed outward. Furthermore, a second space 43 is formed in a resin mold 15 so that the chip penetrating hole 3c may be communicated with the outside of the resin mold 17 from the other surface 3b of the stage 3. COPYRIGHT: (C)2007,JPO&INPIT |
