| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing semiconductor chips by which dicing is carried out without causing quality deterioration due to deposited particles. SOLUTION: In the method of manufacturing the semiconductor chips for manufacturing the semiconductor chips 1d by dividing a semiconductor wafer into each semiconductor device, a mask 3 formed for plasma dicing in which the semiconductor wafer is divided by plasma etching is removed by mechanical grinding using a grinding head 26. Thus, occurrence is prevented in reaction products inevitable when removing the mask by plasma ashing, so that dicing is carried out without occurrence of quality deterioration due to the deposited particles. COPYRIGHT: (C)2007,JPO&INPIT |
