| 摘要 |
PROBLEM TO BE SOLVED: To enhance the heat radiating function of a heat generating component having a low heat resistance in components mounted on a component mounted board, and to apply heat insulation between heat generating components having high and low heat resistances and heat non-generating components having high and low heat resistances. SOLUTION: In a lead frame substrate 1, a high heat radiating member layer 11 made of a resin having a relatively high heat conductivity is provided at a mounting site 7 of a low-heat-resistance heat generating component having a low-heat-resistance heat generating component 4A mounted thereat, a low heat radiating member layer 12 made of a resin having a relatively low heat conductivity is provided at a mounting site 8 of a high-heat resistance heat generating component, a high heat insulating member layer 13 made of a resin having a relatively high heat insulating property is provided at a mounting site 9 of a low-heat-resistance heat non-generating component having a low-heat-resistance heat non-generating component 5A mounted thereat, and a low heat insulating member layer 14 made of a resin having a relatively low heat insulating property is provided at a mounting site 10 of a high-heat-resistance heat non-generating component for a high-heat-resistance heat non-generating component 5B to be mounted thereat. COPYRIGHT: (C)2007,JPO&INPIT |
