| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat resistant cushioning material for a molding press for use in the manufacture of the laminates for printed wiring boards, printed wiring boards, CSPs, and flat panel displays, of which cushion volume can be increased without changing its temperature rising speed thereby allowing uniform heat distribution. SOLUTION: The heat resistant cushioning material for press molding 2 is formed by laminating one or more layers of batting onto one side or both sides of a base fabric and integrating the batting fibers and the base fabric by needling, the batt fiber consisting of one or more kinds of fibers being the same as or different from those used for the base fabric, wherein the cushioning material comprises such heat conductive fibers that a product, formed of the heat conductive fibers and configured to have a basis weight of 4,000 g/m<SP>2</SP>, has a temperature rising speed of not smaller than 3.6°C/min in a range of 90-140°C. COPYRIGHT: (C)2007,JPO&INPIT |
