| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing apparatus for a semiconductor device capable of remarkably increasing adhesiveness when it holds the semiconductor device. SOLUTION: This manufacturing apparatus has a heater stage 203 that can be heated, and four rollers 205 that can move while applying pressure to the front surface of the heater stage 203. In the part of the heater stage 203 where a semiconductor device 204 is mounted, a minute hole 206 for vacuum absorption is formed to fix the semiconductor device 204. The semiconductor device 204 is fixed to the heater stage 203 by attracting the semiconductor device 204 through the minute hole 206 after the heater stage 203 and a vacuum pump are connected with a metallic pipe of a small diameter or the like. COPYRIGHT: (C)2007,JPO&INPIT |
