| 摘要 |
PROBLEM TO BE SOLVED: To provide a processing board (packaging substrate) suited to the small production of printed circuit boards (product boards) having high dimensional accuracy and different shapes without generating the increase of processing costs or the reduction of material yield, a method for manufacturing the processing board, and a method for manufacturing the printed circuit boards (product boards). SOLUTION: The processing board is provided with a frame part 12 having at least two reference sides 12a, 12b almost rectangular to each other on its outer periphery, a product plate 14 connected to the frame part 12 through straight parts 14a, 14b arranged in non-parallel and non-rectangular with/to the reference sides 12a, 12b, a pair of notches 16a to 16d formed on the frame part 12 almost in parallel with the straight parts 14a, 14b, and V cuts 18a, 18b formed on the straight parts 14a, 14b or their vicinity. The processing board 10, the method for manufacturing the processing board 10, and the product board manufacturing method for cutting off the frame part 12 from the processing board 10 along the V cuts 18a, 18b are provided. COPYRIGHT: (C)2007,JPO&INPIT
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