| 摘要 |
The present invention is to provide a low-cost piezoelectric device with a CSP structure, particularly, a surface acoustic wave device. Therefore, the invention is directed to a piezoelectric device which includes: a piezoelectric vibrator provided on one principal face thereof with at least an exciting electrode and a bonding pad extending from the exciting electrode; and a flat plate-like printed circuit board having a pad electrode for mounting of the piezoelectric vibrator and a grounding pad arranged on an upper face and an external electrode on a lower face, in which the piezoelectric vibrator is fixed to the upper face of the printed circuit board through a predetermined gap by connecting the bonding pad and the pad electrode via a metal bump, wherein a metal layer having a thickness larger than an opening size of the gap is formed on a whole surface of the upper face of the piezoelectric device.
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