LEADFRAME STRIP AND MOLD APPARATUS FOR AN ELECTRONIC COMPONENT AND METHOD OF ENCAPSULATING AN ELECTRONIC COMPONENT

摘要

A leadframe strip (1) comprises a plurality of units (2) arranged in a line. Each unit (2) provides two component positions (3), each having a chip support substrate (6). The chip support substrates (6) of the two component positions (3) are mechanically linked by at least one support bar (18). The two component positions (3) of a unit (2) are molded at essentially the same time to produce a plastic housing (25) for a package (24) in each component position (3). The central portion of the first support bars (18) remains outside of the plastic housing (25) of the two packages (24).