发明名称 ELECTRONIC COMPONENT, MODULE, MODULE ASSEMBLING METHOD, MODULE IDENTIFICATION METHOD, AND MODULE ENVIRONMENT SETTING METHOD
摘要 <p>An electronic component capable of being assembled into a module in the form of a stack of a plurality of layers is provided. Terminals of terminal groups ( 31 to 36 ) are formed so as to have rotational symmetry of a predetermined fold-number or have rotational symmetry and symmetry with respect to the plane containing a symmetric axis line. The terminals (A 0 to A 7 , RFCG) of common connection terminal groups ( 32, 36 ) have connecting portions formed on the both surfaces in a stacking direction. Among the terminals of individual connection terminal groups ( 31, 33 ), a specific terminal CS; KEY has a connection portion formed at least on one of the both surfaces in the stacking direction while the remaining associated terminals NC; DMY have connection portions formed on the both surfaces in the stacking direction. When such electronic components ( 20 ) are stacked so as to be shifted from each other by the angle obtained by dividing 360 degrees by the predetermined fold-number or in addition in the inverted state, it is possible to assemble a module using the electronic components ( 20 ) having the same configuration.</p>
申请公布号 KR100674484(B1) 申请公布日期 2007.01.25
申请号 KR20057022729 申请日期 2005.11.28
申请人 发明人
分类号 H01L25/065;H01L25/18;H01L23/48;H01L25/07;H01L25/10;H01L25/11;H01L29/06 主分类号 H01L25/065
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